On December 27th,a delegation of experts from Intel,a global leader in the semiconductor industry,visited Millison.The two parties conducted in-depth exchanges on advanced thermal management technologies and high-power computing infrastructure, reached a high degree of consensus on technical routes, application scenarios, and cooperation models, and formed a clear preliminary cooperation intention.
With the exponential growth in computing power demand driven by artificial intelligence, cloud computing, and other technologies, chip power density continues to rise, making thermal management capability a key bottleneck restricting the continuous evolution of high-performance chips and server platforms. Efficient, reliable, and scalable advanced thermal management solutions are not only the core foundation for ensuring the stable release of chip performance but also becoming a strategic commanding height in the global competition for computing infrastructure.
During this exchange, Intel highly recognized Millison systematic capabilities and industrialization advantages in the fields of high-performance thermal management materials, innovative process structure design, and ultra-precision manufacturing, believing that Millison has a solid foundation to become a long-term core partner in the segment of key advanced thermal management components. The two parties plan to give full play to their respective advantages in technological R&D, platform ecology, and manufacturing capabilities to achieve in-depth synergy and complementarity.
Leveraging Intel's forward-looking layout in advanced thermal management technology systems and platform-level integration, combined with Millison's profound accumulation in large-scale manufacturing and engineering implementation, the two parties intend to jointly develop advanced thermal management solutions for high-power AI servers. Through the newly established joint venture platform between Millison and Stellar G-Energy, they will accelerate the engineering verification and commercial application of innovative technologies.
This exchange indicates that the two parties have significant alignment on future cooperation directions and marks that Millison's strategic layout in the global advanced thermal management and AI computing infrastructure fields has entered a new phase. It is not only an important achievement of the company's firm promotion of the "industrial diversification and business globalization" development strategy but also will effectively drive Millison to build a future oriented platform for liquid cooling key components of high power AI servers, continuously enhancing its core competitiveness in the global high-end manufacturing system.
